| PART |
Description |
Maker |
| IDD05SG60C |
3rd Generation thinQ!TM SiC Schottky Diode
|
Infineon Technologies AG
|
| ARK-DS262 |
3rd Generation Intel? Core i7 Processor-based Digital Signage Platform
|
Advantech Co., Ltd.
|
| ARK-2150LS-S7A1E AMK-R004E |
3rd Generation Intel Core i3/i7 with Dual Independent Display Fanless Box PC
|
Advantech Co., Ltd.
|
| EMB-H61B-A10 |
Mini-ITX Embedded Motherboard with Intel 2nd/3rd Generation Core i7/ i5/ i3 Processor
|
AAEON Technology
|
| TKS-G21-QM77 TBD |
Fanless Embedded Box for Intel R 3rd Generation Core Tm i7/i3/Celeron R Mobile Processor
|
AAEON Technology
|
| IBR-I3-R-3217UE IBR-I7-R-3555LE |
Extreme Rugged COM Express? Type 6 Module with 3rd Generation Intel? Core i3/i7 Processor
Extreme Rugged?COM Express? Type 6 Module with 3rd Generation Intel? Core?i3/i7 Processor
|
List of Unclassifed Manufacturers
List of Unclassifed Man...
|
| MIC-3395C1-M4E MIC-3395A1-M4E MIC-3395B1-M4E MIC-3 |
6U CompactPCI? 2nd and 3rd Generation Intel Core i3/i5/i7 Processor Blade with ECC Support
|
Advantech Co., Ltd.
|
| FSB-B75G-A10-G2 FSB-B75G-15 |
PICMG 1.0
Full-Size SBC with Intel 3rd Generation Core i7/i5/i3 LGA 1155 Processor
|
AAEON Technology
|
| ITA-5730-10A1E |
Intel? 3rd Generation Core?i Processor Fanless System EN 50155 Certified Product for Railway Applications
|
Advantech Co., Ltd.
|
| IDC08S60C |
2nd generation thinQ! SiC Schottky Diode
|
Infineon Technologies
|
