| PART |
Description |
Maker |
| 3N206 3N205 BF800 BF804 BF803 BF805 BF801 BF802 |
Discrete Semiconductors
Electrical Specifications at 25oC
Discrete Semiconductors
|
American Microsemicondu...
|
| EU2-EU2Z EU2A |
EU2-EU2Z - EU2-EU2Z - EIC discrete Semiconductors
FAST RECOVERY
|
EIC discrete Semiconductors
|
| GSOT05C-HT3 |
Vishay Semiconductors
|
Vishay Intertechnology,Inc.
|
| SML50HB06 |
HIGH PERFORMANCE POWER SEMICONDUCTORS
|
Seme LAB
|
| SML400HB06 |
HIGH PERFORMANCE POWER SEMICONDUCTORS
|
Seme LAB
|
| HL-203K |
Power Semiconductors Data Book 1974
|
AEI Semiconductors
|
| 1820 3620/9 3620/7 3620/8 |
Power Semiconductors Data Book 1974
|
AEI Semiconductors
|
| BCR10AM-10 |
Power and Industrial Semiconductors Data Book
|
N/A
|
| 2SJ211 2SJ211-T2B 2SJ211-L 2SJ211-T1B |
P-CHANNEL MOS FET FOR SWITCHING
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0621-7 00; No. of Positions: 8; Connector Type: Panel
|
NEC[NEC]
NEC Corp.
|
| 30CTH02 30CTH02-1 30CTH02FP 30CTH02S |
200V 20A HyperFast Discrete Diode in a TO-220AB package
300V 20A HyperFast Discrete Diode in a TO-262 package
300V 20A HyperFast Discrete Diode in a TO-220 FullPak package
200V 30A HyperFast Discrete Diode in a D2-Pak package
|
International Rectifier
|
| HGT2100-100 HGT2100-1000 |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0684-7 53; Contact Mating Area Plating: Gold 工业控制IC
Industrial Control IC 工业控制IC
|
IDEC, Corp.
|
