| PART |
Description |
Maker |
| KS57P2316 |
BONDING DIAGRAM
|
Samsung semiconductor
|
| PCR |
Termination available for wire bonding or soldering
|
TT Electronics.
|
| WBSC0504-22NF-50V |
Wire Bonding Silicon Vertical Capacitor
|
Micross Components
|
| TAB-35006 |
Tape Carrier Package/Tape Automated Bonding (TCP/TAB)
|
Yamaichi Electronics
|
| PG12864-O |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
POWERTIP[Powertip Technology]
Powertip Technology Corp.
|
| PG240128-A PG240128 |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| CM1429 CM-1829 CM1819 CM1419 CM-1429 CM1829 CM1829 |
8-2 P.C.B Circuit Diagram
|
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Electronic
|
| ND7060 |
Block Diagram
|
ETC
|
| KX-T2365SU |
SCHEMATIC DIAGRAM
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| MC9RS08KA8CPG MC9RS08KA8CPJ MC9RS08KA8CTG MC9RS08K |
MCU Block Diagram
|
Freescale Semiconductor, Inc
|
