| PART |
Description |
Maker |
| 8143RPFS 8143 8143RPFB 8143RPFE 8143RPFI |
12-Bit Serial Daisy Chain D/A Converter
|
MAXWELL[Maxwell Technologies]
|
| DAC8143 DAC8143FP DAC8143FS |
12-Bit Serial Daisy-Chain CMOS D/A Converter
|
AD[Analog Devices]
|
| M6MGT647M34CKT M6MGB647M34CKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品（MCP）的512兆位2兆16位）的CMOS 1.8伏，只有同时写，突发模式闪存
|
Spansion Inc.
Spansion, Inc.
|
| DS42514 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
From old datasheet system
|
AMD[Advanced Micro Devices]
|
| F4655-1305 |
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 μm Channel Diameter
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 レm Channel Diameter
|
Hamamatsu Corporation
|
| DS42587 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| DS42585 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
|
| SDKN-89-87-M07 |
N CAP & CHAIN
|
Winchester Electronics Corporation
|
