| PART |
Description |
Maker |
| LTV817MV |
High Density Mounting Type Photocoupler
|
LITEON
|
| LTV817 LTV827 LTV847 |
HIgh Density Mounting Type Photocoupler
|
TMT[Taiwan Memory Technology]
LITEON
|
| PC818 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Components
|
| HCPL-817-36DE HCPL-817-36CE HCPL-817-36AE HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
|
| HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSM88WA |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| EC2-6 EC2 EC2-12ND EC2-12NP EC2-12NU EC2-12NJ EC2- |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type
COMPACT AND LIGHTWEIGHT/ SMALL MOUNTING SIZE/ HIGH BREAKDOWN VOLTAGE
High Insulation/ High breakdown voltage/ compact and lightweight/ Surface mounting type
A/D Converter (A-D) IC; Resolution (Bits):24; Sample Rate:192kSPS; Input Channels Per ADC:8; Input Channel Type:Differential; Data Interface:Serial; Package/Case:48-LQFP RoHS Compliant: Yes
CONNECTOR ACCESSORY
Film Capacitor; Capacitor Type:Suppression; Voltage Rating:100VDC; Capacitor Dielectric Material:Polyester; Capacitance:0.022uF; Capacitance Tolerance: 10%; Lead Pitch:5.00mm; Leaded Process Compatible:Yes RoHS Compliant: Yes
COMPACT AND LIGHTWEIGHT, SMALL MOUNTING SIZE, HIGH BREAKDOWN VOLTAGE 小巧轻盈，小安装尺寸，高击穿电压
|
NEC Corp.
NEC, Corp.
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
Lite-On Technology Corporation
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
光宝科技股份有限公司
|
| ISP521-1 ISP521-1X ISP521-108 ISP521-2 ISP521-2X I |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
