| PART |
Description |
Maker |
| LRS1380J |
STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 4M (X 16) SRAM
|
Sharp Electrionic Components
|
| LH28F320S5H-L |
32M-BIT ( 2Mbit x16 / 4Mbit x8 )Boot Block Flash MEMORY(32M 2Mx16 / 4Mx8 )Boot Block 闪速存储器)
|
Sharp Corporation
|
| LRS1381 |
STACKED CHIP 32M FLASH AND 4M SRAM
|
Sharp Electrionic Components
|
| LRS1380 |
STACKED CHIP 32M (X 16) FLASH AND 4M (X 16) SRAM
|
Sanyo Semicon Device
|
| RD28F3208C3T70 RD28F3208C3B90 |
TVS BIDIRECT 400W 90V SMA
3 VOLT INTEL Advanced Boot Block Flash Memory (C3) Stacked-Chip ScalPackage Familye SPECIALTY MEMORY CIRCUIT, PBGA66
|
INTEL CORP
Intel, Corp.
|
| S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| KMM372V3280BK3 |
32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块）
|
Samsung Semiconductor Co., Ltd.
|
| IBM11M32735C |
32M x 72 DRAM Module(32M x 72动态RAM模块) 32M × 72配置内存2M × 72配置动态内存模块）
|
International Business Machines, Corp.
|
| IBM13N32644JCA-260T IBM13N32734JCA-260T IBM13N3264 |
x64 SDRAM Module
32M x 64 Two-Bank Unbuffered SDRAM Module(32M x 64 2组不带缓的冲同步动态RAM模块)
x72 SDRAM Module x72内存模块
32M x 72 Two-Bank Unbuffered SDRAM Module(32M x 72 2组不带缓冲的同步动态RAM模块) 32M × 72配置双行缓冲内存模组2M × 72配置2组不带缓冲的同步动态内存模块）
|
IBM Microeletronics
DB Lectro, Inc.
International Business Machines, Corp.
|
| S71WS128JB0BAWTY0 S71WS128JB0BAWTY2 |
Stacked Multi-Chip Product (MCP)
|
SPANSION
|
| S73WS256ND0BFWAB3 S73WS256NDEBAWA70 S73WS256NDEBAW |
Stacked Multi-Chip Product (MCP)
|
SPANSION[SPANSION]
|
