| PART |
Description |
Maker |
| S70WS512N00BAWA30 S70WS512N000BAWA33 |
32M X 16 FLASH 1.8V PROM, 80 ns, PBGA84
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
|
SPANSION LLC
|
| LRS1382 |
STACKED CHIP 32M FLASH AND 8M SRAM
|
Sharp Electrionic Components
|
| LRS1383H |
STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 8M (X 16) SRAM
|
Sharp Electrionic Components
|
| AM70PDL127CDH66IT AM70PDL127CDH85IS AM70PDL127CDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装（MCP / XIP）的快闪记忆体，数据存储的MirrorBit闪存和移动存储芯片（XIP）的
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) SPECIALTY MEMORY CIRCUIT, PBGA93
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位）的CMOS 3.0伏特，只有页面模式闪存数据存28兆位米16位）的CMOS
|
Spansion Inc.
Spansion, Inc.
|
| LRS1341 LRS1342 |
Stacked Chip 16M Flash Memory and 2M SRAM
|
SHARP[Sharp Electrionic Components]
|
| S71PL032J S71PL032J04 S71PL032J08 S71PL032JA0 S71P |
STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
|
SPANSION[SPANSION]
|
| S71PL254 |
STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
|
SPANSION
|
| S71AL016M40 S71AL016M |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM
|
SPANSION[SPANSION]
|
| MB84VD23381FJ-80PBS MB84VD23381FJ MB84VD23381FJ-80 |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM
|
FUJITSU[Fujitsu Media Devices Limited]
|
| AM50DL128BG70I AM50DL128BG85I AM50DLI28BG |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
