| PART |
Description |
Maker |
| MCF53017CMJ240 MCF53014CMJ240 MCF53015CMJ240 MCF53 |
Version 3 ColdFire? core with EMAC
Version 3 ColdFire庐 core with EMAC
Version 3 ColdFire垄莽 core with EMAC
|
Freescale Semiconductor, Inc
|
| M37735EHBXXXFP M37735EHBFS |
PROM VERSION OF M37735MHBXXXFP
PROM VERSION OF M37735EHBXXXFP
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| 74062-2594 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits, Pin
|
Molex Electronics Ltd.
|
| KM48L16031BT-GF0 KM48L16031BT-GFY KM48L16031BT-GFZ |
128 Mb DDR SDRAM. Version 0.61, Operating freq. 100 MHz, speed 10ns.
DDR SDRAM Specification Version 0.61
128Mb DDR SDRAM
128 Mb DDR SDRAM. Version 0.61, Operating freq. 133 MHz, speed 7.5 ns.
|
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| 74059-1014 0740591014 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Leng
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length 5.15mm (.203)
|
Molex Electronics Ltd.
|
| U3665M U3665M-MDP U3665M-MFP |
SPECIALTY CONSUMER CIRCUIT, PDIP16
Baseband Delay Line 64 us (Improved Version)
Baseband Delay Line 0.064 ms (Improved Version)
|
TEMIC[TEMIC Semiconductors]
|
| 74059-2503 0740592503 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 150 Circuits, Pin
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 150 Circuits, Pin
|
Molex Electronics Ltd.
http://
|
| MX93032-MI MX93032 |
APPLICATION NOTE [M1 VERSION]
APPLICATION NOTE [M1 VERSION] 应用笔记[货币供应量M1版本]
|
Macronix International Co., Ltd.
|
| U3666M U3666M-MFP U3666M-MDP |
Baseband Delay Line o.o64 ms (Improved Version of U3665M)
Baseband Delay Line 64 xs (Improved Version of U3665M)
Baseband Delay Line 64 us (Improved Version of U3665M)
|
Atmel
TEMIC[TEMIC Semiconductors]
|
| W83877ATF W83877ATD |
enhanced version from Winbonds most popular I/O chip W83877F
enhanced version from Winbonds most popular I/O chip W83877F
|
Winbond Electronics Corp
|
| AT71200M AT71200MCRER AT71200MCRERB AT71200MCRHR |
AT71200M Monochrome [Updated 2/03. 23 Pages] Full field CCD. 3500 x 2300 pixels. 4 x 25 MHz
Full field image sensor 3500 x 2300 pixels, 4 x 25 MHz
8M-pixel color image sensor. Full frame version standard image grade. Anti-reflective window.
8M-pixel color image sensor. Frame transfer version with two memories zones. Anti-reflective window.
8M-pixel color image sensor. Full frame version high image grade. Anti-reflective window.
|
Atmel
|
