| PART |
Description |
Maker |
| TSC607-ZPPACKOF10 TSC506-ZP |
IC FLEX 10KE FPGA 200K 600-BGA
780-pin FineLine BGA BEFESTIGUNGSKLAMMER多珀0ST
|
OSRAM GmbH
|
| V54C3256164VBUC V54C3256164VBUT V54C3256164VBLT7 |
16M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
LOW POWER 256Mbit SDRAM 3.3 VOLT, 54-BALL SOC BGA 54-PIN TSOPII 16M X 16
LOW POWER 256Mbit SDRAM 3.3 VOLT/ 54-BALL SOC BGA 54-PIN TSOPII 16M X 16
|
MOSEL-VITELIC
Mosel Vitelic, Corp.
Mosel Vitelic Corp
|
| TC0412A |
SAW Resonator 672.531 MHz SMD 3.0X3.0 mm
|
TAI-SAW TECHNOLOGY CO., LTD.
|
| ATS012012010-PF-2I |
12.00 x 12.00 x 10.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS040040006-PF-13E |
40.00 x 40.00 x 6.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS012012020-PF-2S |
12.00 x 12.00 x 20.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS019019019-PF-6R |
19.00 x 19.00 x 19.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS031031025-PF-10X |
31.00 x 31.00 x 25.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS015015014-PF-4M |
15.00 x 15.00 x 14.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS019019003-PF-6B |
19.00 x 19.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS040040013-PF-13L |
40.00 x 40.00 x 13.00 mm BGA Heat SInk (High Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
