| PART |
Description |
Maker |
| KTD2005 |
Low ON resistance 2.5V drive Mounting height 1.1mm Composite type, facilitating high-density mounting.
|
TY Semiconductor Co., Ltd
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
| LTV-849 LTV-849M LTV-849S LTV-829 LTV-829S-TA LTV8 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
LITEON[Lite-On Technology Corporation]
|
| HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
|
| HCPL-817 HCPL-817-0 HCPL-817-3 HCPL-817-5 HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type 光电晶体管光电耦合器高密度安装类型
|
TE Connectivity, Ltd.
Avago Technologies, Ltd.
Diodes, Inc.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
|
| UDZSTE-1720B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| UDZSTE-175.1B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| PC817SERIES PC817 |
1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER
High Density Mounting Type Photocoupler
|
Sharp Electronics Corp.
|
| LTV-819-2S-TA LTV-819-2S-TA1 LTV849-V LTV849M-V LT |
High Density Mounting Type Photocoupler
High Density Mounting Type Photocoupler
|
Shenzhen Tenand Technology Co., Ltd.
Shenzhen Tenand Technol...
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
