| PART |
Description |
Maker |
| FPT-8P-M02 |
SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC
|
Fujitsu Limited
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP9451GG |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2321GN-HF AP2321GN-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| LC33832M-70 LC33832P-70 LC33832M-10 LC33832PL-10 L |
Small outline package version of the LC33832SL
x8 Pseudo-Static RAM
|
Sanyo Semiconductor
|
| AP2310CGN-HF AP2310CGN-HF-14 |
Simple Drive Requirement, Small Package Outline, Surface Mount Device
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2310GN |
Simple Drive Requirement Small Package Outline Surface Mount Device
|
TY Semiconductor Co., Ltd
|
| RQ-16 |
16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
|
Analog Devices
|
| MT2LDT432HG-6X MT2LDT432HG-5X MT4LDT832HG-5XS MT2L |
SMALL-OUTLINE DRAM MODULE 小外形DRAM模块
Silver Mica Capacitor; Capacitance:1200pF; Capacitance Tolerance: 5%; Series:CDV30; Voltage Rating:1500VDC; Capacitor Dielectric Material:Mica; Termination:Radial Leaded; Lead Pitch:11.1mm; Leaded Process Compatible:No RoHS Compliant: No 小外形DRAM模块
|
Micron Technology, Inc.
|
