| PART |
Description |
Maker |
| HDG320240 320240 |
Chip On Glass technology 320 X 240 Dots Graphics
Chip On Glass technology 在玻璃芯片技
|
List of Unclassifed Manufacturers
ETC[ETC]
Hantronix,Inc
Electronic Theatre Controls, Inc.
|
| NHD-C160100CZ-RN-FBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C0220AZ-FSW-FTW |
COG (Chip-on-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C128128BZ-FSW-GBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| THM321000S-10 THM321000S-80 THM321000SG-10 THM3210 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
1,048,576 WORDS x 32 BIT DYNAMIC RAM MODULE
1/048/576 WORDS x 32 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| LE-RTDUWS-2W |
compact lightsource in multi chip SMT technology with glass window on top
|
OSRAM GmbH
|
| LEUWS2W-PXQX-4P7R |
compact lightsource in multi chip SMT technology with glass window on top
|
OSRAM GmbH
|
| 5962R9582501QEC 5962R9582501QXC 5962R9582501VEC 59 |
Radiation Hardened 3-Line to 8-Line Decoder/Demultiplexer 辐射加固3线至8线译码器/解复用器
150 PF 5% 50V NPO/COG (0805) CHIP CAP TR
From old datasheet system
|
Intersil, Corp.
INTERSIL[Intersil Corporation]
|
| BC7-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| FT231XS-X FT231XQ-X DSFT231X FT231XQ-T FT231XS-R |
Future Technology Devices International Ltd FT231X
Single chip USB to asynchronous serial data transfer interface
Future Technology Devices International Ltd.
|
List of Unclassifed Manufacturers
Future Technology Devices I...
Future Technology Devic...
|
