| PART |
Description |
Maker |
| 02113 02113-3 |
HEATSINK 9INCH HGT VERT
|
VICOR[Vicor Corporation]
|
| 104930-3 104930-1 |
VERBINDER PCB/EINZELLEITER HOR 8POL VERBINDER多氯联苯/ EINZELLEITER贺永8POL
VERBINDER PCB/EINZELLEITER HOR 4POL VERBINDER多氯联苯/ EINZELLEITER贺永4POL
|
TE Connectivity, Ltd.
|
| 53885-0308 |
0.5 BOARD TO BOARD Conn PLUG Hgt=2.5mm
|
Molex Electronics Ltd.
|
| STK15C88 STK15C88-N25 STK15C88-N25I STK15C88-N35 S |
HEATSINK TO-220 DUAL MT W/CLIPS 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器
HEATSINK TO-218 10W H=2.5 BLK 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器
HEAT SINK .720 HIGH RISE TO-220 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器
32K x 8 AutoStore nvSRAM High Performance CMOS Nonvolatile Static RAM 32K的8自动存储非易失高性能CMOS非易失性静态随机存储器
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
ETC[ETC]
SIMTEK
|
| 0547220207 |
0.5 B-TO-B CONN REC HOUSING ASSY (HGT-1.5) (SHEET 1 OF 2)
|
Molex Electronics Ltd.
|
| WF070000 |
HEATSINK
|
celduc-relais
|
| WF050000 |
HEATSINK
|
celduc-relais
|
| WF131100 |
HEATSINK
|
celduc-relais
|
| WF129100 |
HEATSINK
|
http://
celduc-relais
|
| WF152100 |
HEATSINK
|
celduc-relais
|
| DO1 DO2 DO3 |
Heatsink DOx
|
HB Electronic Components
|
| P9_430 2XP9_210 P9 2XP9/210 |
Heatsink For capsule devices
|
SEMIKRON[Semikron International]
|
