| PART |
Description |
Maker |
| HEDS-6500-A05 HEDS-6500-A10 HEDS-6500-A11 HEDS-650 |
HEDS-6510#005 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6505#B05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6500#A05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6500#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6505#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6545#B09 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6540#B11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6540#T11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
Large Diameter (56 mm), Housed Two and Three Channel Optical Enco
|
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
|
| 0440671003 44067-1003 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-0403 0440670403 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
|
Molex Electronics Ltd.
|
| 44067-0401 0440670401 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
| PE1001-1 |
Hermetic Seal Solder Contact With 0.012 Pin Diameter, 0.1 Body Diameter And 0.18 Pin Length
|
Pasternack Enterprises, Inc.
|
| 44067-1801 0440671801 |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 87639-1011 0876391011 |
1.27mm (.050") Pitch DDR DIMM Socket, Reverse Footprint, 25掳 Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 3.56mm (.140") Tail Lengt
1.27mm (.050) Pitch DDR DIMM Socket, Reverse Footprint, 25° Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 3.56mm (.140) Tail Length
|
Molex Electronics Ltd.
|
| 0440672001 44067-2001 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-1603 0440671603 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87609-0071 0876090071 |
1.27mm (.050) Pitch DIMM 8-Byte Socket, Right Angle, Multi-Key, 168 Circuits, with Beveled Metal Pins and Plastic Pegs, with Beige Latches, 3.56mm (.140) Tail Length
|
Molex Electronics Ltd.
|
| 0440672403 44067-2403 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 61627 61627-1 61627-2 |
.140 DIA PIN
|
Tyco Electronics
|
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