| PART |
Description |
Maker |
| 73K222BL-IGT 73K222BL-IH 73K224AL 73K224BL |
V.22, V.21, Bell 212A, Bell 103 Single-Chip Modem with Integrated Hybrid
|
http://
|
| 73K224L |
V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem
|
TDK Electronics
|
| 73K224L-IGT 73K224L-IP 73K224L-IH 73K224L-28IH |
V.22BIS/V.22/V.21/ BELL 212A/BELL 103 SINGLE-CHIP MODEM
|
TDK Semiconductor
TDK Electronics
ETC
|
| 73K324L-IP 73K324L-IGT 73K324L-28IH |
2.4 kbps DATA, MODEM, PQFP44
CCITT V.22bis/ V.22/ V.21/ V.23/ Bell 212A Single-Chip Modem
CCITT V.22bis, V.22, V.21, V.23, Bell 212A Single-Chip Modem 国际电话电报谘询委员会V.22bis222123，贝12A章单芯片调制解调
|
TERIDIAN SEMICONDUCTOR CORP
List of Unclassifed Manufacturers
ETC
Electronic Theatre Controls, Inc.
|
| 73K224BL |
V.22bis/V.22/V.21/Bell 212A/103 Single-Chip Modem w/ Integrated Hybrid(V.22bis/V.22/V.21/Bell 212A/103单片Modem w/ 集成混合电路)
|
TDK Corporation
|
| CMX644AD2 CMX644AD5 |
V.22 and Bell 212A Modem
|
CML Microcircuits
|
| 73K222AL 73K222AL-IGT 73K222AL-IH 73K222AL-IP 73K2 |
V.22, V.21, Bell 212A, 103 Single-Chip Modem
|
TDK Electronics
ETC
TDK Semiconductor
|
| MRCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215
|
Vishay
|
| H66T19AA H66T19BA H66T32BA H66T68AA H66T68 H66T68B |
64-Note ROM memory Dynamic speaker can be driven with external NPN transistor
CMOS LSI DESIGNED FOR USE IN DOOR BELL/ TELEPHONE AND TOY
CMOS LSI DESIGNED FOR USE IN DOOR BELL, TELEPHONE AND TOY
|
MICRO-ELECTRONICS[Micro Electronics]
HSMC
Hi-Sincerity Mocroelectronics
Hi-Sincerity Microelectronics
|
| X0405BE X0403ME |
SILICON CONTROLLED RECTIFIER,200V V(DRM),4A I(T),TO-202
SILICON CONTROLLED RECTIFIER,600V V(DRM),2.4A I(T),TO-202
From old datasheet system
|
ST Microelectronics
|
| ACS103 |
3 Channel, Synchronous or Asynchronous Single Fiber Modem
Acapella Optical Modem IC
|
SEMTECH[Semtech Corporation]
|
| Z0220112VSC Z0220112VEC |
MODEM CIRCUIT,MODEM,LDCC,44PIN,PLASTIC
From old datasheet system
|
Zilog Inc
|
