| PART |
Description |
Maker |
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS
|
| LTV817MV |
High Density Mounting Type Photocoupler
|
LITEON
|
| PC-815 |
High Sensitivity, High Density Mounting Type Photocoupler
|
N/A
|
| ISP815 ISP815X ISP825 ISP845 ISP845X ISP825X |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
ISOCOM[ISOCOM COMPONENTS]
|
| TIL191A TIL191B TIL193A TIL193B TIL192A TIL192B |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
http://
|
| HCPL-817 HCPL-817-0 HCPL-817-3 HCPL-817-5 HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type 光电晶体管光电耦合器高密度安装类型
|
TE Connectivity, Ltd.
Avago Technologies, Ltd.
Diodes, Inc.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
|
| TIL198 TIL198A TIL198B TIL197B TIL1B98A TIL1B98B T |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ETC[ETC]
|
