| PART |
Description |
Maker |
| WED2ZL361MSJ-BC WED2ZL361MSJ26BI WED2ZL361MSJ42BC |
NBL SSRAM MCP
1M X 36 MULTI DEVICE SRAM MODULE, 2.6 ns, PBGA119
1M X 36 MULTI DEVICE SRAM MODULE, 4.2 ns, PBGA119
|
WHITE ELECTRONIC DESIGNS CORP
|
| M6MGT331S4BKT M6MGB331S4BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| EDI9LC644V EDI9LC644AV2010BC EDI9LC644AV1512BC EDI |
128Kx32 SSRAM/1Mx32 SDRAM Array(3.3V,128x32同步静态RAMB>1Mx32同步动态RAM阵列)
128Kx32 SSRAM/1Mx32 SDRAM Array(3.3V,128x32同步静态RAMMx32同步动态RAM阵列)
SPECIALTY MEMORY CIRCUIT, PBGA153
|
White Electronic Designs Corporation
|
| S75PL127NBFJFWGZ2 S75PL127NCFJFWGZ3 S75PL256NCFJFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| NBL15602S |
KEMET, NBL, Transducers, Single-layer
|
Kemet Corporation
|
| S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品（MCP）的512兆位2兆16位）的CMOS 1.8伏，只有同时写，突发模式闪存
|
Spansion Inc.
Spansion, Inc.
|
| UT8SF2M40MSPA |
UT8SF2M40 80Megabit Flow-thru SSRAM
|
Aeroflex Circuit Techno...
|
| WED9LC6416V2012BI WED9LC6416V WED9LC6416V1310BC WE |
128Kx32 SSRAM/4Mx32 SDRAM
|
White Electronic Designs
ETC[ETC]
|
| AS5SS256K36ADQ-8.5XT AS5SS256K36ADQ-10IT AS5SS256K |
256K x 36 SSRAM - synchronous burst SRAM, flow-thru
|
Austin Semiconductor
|
| WED9LC6816V1310BI WED9LC6816V1512BI |
256K X 32 SSRAM/ 4M X 32 SDRAM 256 × 32的SSRAM / 4米32内存
|
Electronic Theatre Controls, Inc.
|
