| PART |
Description |
Maker |
| HSM88WA |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV-849 LTV-849M LTV-849S LTV-829 LTV-829S-TA LTV8 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
LITEON[Lite-On Technology Corporation]
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
| HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
Lite-On Technology Corporation
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| ISP815 ISP815X ISP825 ISP845 ISP845X ISP825X |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
ISOCOM[ISOCOM COMPONENTS]
|
| IS354 |
HIGH DENSITY MOUNTING AC INPUT, PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
Electronic Theatre Controls, Inc.
|
