| PART |
Description |
Maker |
| X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT
PACKAGE OUTLINE DIMENSIONS
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
| P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| 21-0111 |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD
|
Maxim Integrated Products
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| WCSMCFC-32.768KHZ- WCSMCF-32.768KHZ-6 WCSMCC-32.76 |
4 Pad Ceramic SMD Package
|
MMD Components
http://
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| J20.BPACKAGE |
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| AXX5032-2 |
Quartz Crystal Unit in SMD package 5.0x3.2 mm Resin sealed 2 pad
|
Advanced XTAL Products
|
| SSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
