| PART |
Description |
Maker |
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| SO-8 |
8-LEAD SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| POWERSOP |
Power Small Outline Package,PowerSOP
|
Amkor Technology
|
| SSOP24 |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
|
STMicroelectronics
ST Microelectronics
|
| FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE 小外形L -引线封装
|
Fujitsu Limited
Fujitsu, Ltd.
|
| AP2609GY-HF AP2609GY-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2622GY-12 |
Low Gate Charge, Small Package Outline
|
Advanced Power Electron...
|
| AP2328GN-HF |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
|
| SOT340-1 |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| AP2310CGN-HF AP2310CGN-HF-14 |
Simple Drive Requirement, Small Package Outline, Surface Mount Device
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2318AGEN-HF AP2318AGEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package, Surface Mount Device
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
