| PART |
Description |
Maker |
| HY64UD16322M-DF85E HY64UD16322M-DF85I HY64UD16322M |
Mobile PSRAM - 32Mb
2M x 16 bit Low Low Power 1T/1C Pseudo SRAM
x16|3.0(VDD)3.0(VDDQ)V|70/85|Pseudo SRAM - 32M x16 | 3.0（VDD）在3.0（提供VDDQ）V | 70/85 |伪静态存储器- 32M
|
Hynix Semiconductor, Inc.
|
| IBM13M32734BCA |
32M x 72 2-Bank Registered SDRAM Module(32M x 72 2组寄存同步动态RAM模块) 32M × 72配置2，银行注册内存模块（32M × 72配置2组寄存同步动态内存模块）
|
International Business Machines, Corp.
|
| TC58256DC TC58256FT |
256M Bit (32M×8Bits ) CMOS NAND EEPROM(32M×8位与非EEPROM) 256M比特2M的8位）的CMOS闪存EEPROM的（32M的8位与非的EEPROM
|
Toshiba Corporation
Toshiba, Corp.
|
| HY628100A HY628100AG HY628100ALG HY628100ALLG HY62 |
128Kx8bit CMOS SRAM, standby current 1 mA, 70ns
128Kx8bit CMOS SRAM, standby current 1 mA, 55ns
128Kx8bit CMOS SRAM 128Kx8bit CMOS SRAM
Circular Connector; No. of Contacts:3; Series:MS27497; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:12; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No 128Kx8bit CMOS SRAM
|
HYNIX[Hynix Semiconductor]
Hynix Semiconductor Inc.
Hynix Semiconductor, Inc.
|
| KMM372V3200BS1 |
32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块）
|
Samsung Semiconductor Co., Ltd.
|
| AS7C31026 AS7C31026-10 AS7C31026-10BC AS7C31026-10 |
5V/3.3V 64K16 CMOS SRAM
8-Bit Parallel-Load Shift Registers 16-SOIC -40 to 85
CONN SOCKET IC 16-PIN SMD
8-Bit Parallel-Load Shift Registers 16-TSSOP -40 to 85
CONN SOCKET IC 18-PIN SMD
8-Bit Parallel-Load Shift Registers 16-SO -40 to 85 64K X 16 STANDARD SRAM, 20 ns, PBGA48
5V/3.3V 64Kx6 CMOS SRAM 5V/3.3V 64Kx6 CMOS SRAM
5V/3.3V 64Kx6 CMOS SRAM 64K X 16 STANDARD SRAM, 12 ns, PDSO44
5V/3.3V 64Kx6 CMOS SRAM 64K X 16 STANDARD SRAM, 15 ns, PDSO44
5V/3.3V 64Kx6 CMOS SRAM 64K X 16 STANDARD SRAM, 20 ns, PDSO44
5V/3.3V 64Kx6 CMOS SRAM 64K X 16 STANDARD SRAM, 20 ns, PBGA48
5V/3.3V 64Kx6 CMOS SRAM 64K X 16 STANDARD SRAM, 10 ns, PDSO44
|
Alliance Semiconductor ...
ALSC[Alliance Semiconductor Corporation]
ETC[ETC]
Alliance Semiconductor, Corp.
|
| LRS1383 |
STACKED CHIP 32M FLASH AND 8M SRAM
|
Sharp Electrionic Components
|
| LRS1380 |
STACKED CHIP 32M (X 16) FLASH AND 4M (X 16) SRAM
|
Sanyo Semicon Device
|
| HY62CT0808 HY62CT08081E HY62CT08081E-C HY62CT08081 |
22281120 32Kx8bit CMOS SRAM
32Kx8bit CMOS SRAM 32Kx8bit CMOS SRAM
COUNTER, DIGITAL, 6DIGIT, TRANS; Temp, op. max:55(degree C); Temp, op. min:-10(degree C)
|
Hynix Semiconductor, Inc.
Hynix Semiconductor Inc.
HYNIX[Hynix Semiconductor]
|
| IBM13N32644JCA-260T IBM13N32734JCA-260T IBM13N3264 |
x64 SDRAM Module
32M x 64 Two-Bank Unbuffered SDRAM Module(32M x 64 2组不带缓的冲同步动态RAM模块)
x72 SDRAM Module x72内存模块
32M x 72 Two-Bank Unbuffered SDRAM Module(32M x 72 2组不带缓冲的同步动态RAM模块) 32M × 72配置双行缓冲内存模组2M × 72配置2组不带缓冲的同步动态内存模块）
|
IBM Microeletronics
DB Lectro, Inc.
International Business Machines, Corp.
|
