| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| RFHA3942D |
35W Linear GaN on SiC Power Amplifier Die
|
RF Micro Devices
|
| MA08509D |
10W Power Amplifier Die Preliminary Release 8.0-11 GHz
|
MACOM[Tyco Electronics]
|
| PSA4-5043-D PSA4-5043-DF PSA4-5043-DG PSA4-5043-DP |
Monolithic Amplifier Die
|
Mini-Circuits
|
| IXFN340N07 IXFN340N0704 |
HiPerFET?/a> Power MOSFETs Single Die MOSFET
HiPerFET⑩ Power MOSFETs Single Die MOSFET
HiPerFET Power MOSFETs Single Die MOSFET
|
IXYS Corporation
|
| RD25050-W-AU RD25100-W-AU RD251000-W-AU RD25200-W- |
50 V, 25 A, rectifier automotive die
100 V, 25 A, rectifier automotive die
1000 V, 25 A, rectifier automotive die
200 V, 25 A, rectifier automotive die
|
TRANSYS Electronics Limited
|
| MA03503D |
X-Band Parallel Input 5-Bit Attenuator / 6-Bit Phase Shifter / Buffer Amplifier Die
|
Tyco Electronics
|
| CRF24010D |
10 W SiC RF Power MESFET Die
|
CREE[Cree, Inc]
|
| IXFN230N10 |
Power MOSFETs Single Die MOSFET
|
IXYS[IXYS Corporation]
|
| IXFN90N30 |
HiPerFET Power MOSFETs Single Die MOSFET
|
IXYS Corporation
|
