| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 5SMY12K1201 |
IGBT-Die
|
The ABB Group
|
| 5SMX12H1251 |
IGBT-Die
|
ABB
|
| 5SMX12E1273 |
IGBT-Die
|
The ABB Group
|
| DF900R12IP4DV |
Bare Die IGBT
|
Infineon Technologies AG
|
| DD750S65K3 |
Bare Die IGBT
|
Infineon Technologies AG
|
| IGC10R60D |
600 V, N-CHANNEL IGBT 3.73 X 2.70 MM, DIE-2
|
Infineon Technologies AG
|
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| IRG4CH40SB |
IRG4CH40SB IGBT Die in Wafer Form
|
IRF[International Rectifier]
|
| IRG4CC58KB |
IRG4CC58KB IGBT Die in Wafer Form
|
International Rectifier
|
