| PART |
Description |
Maker |
| 2009G13 |
22 mm Aluminum Enclosure Gravity Die Cast 2005G13 and 2009G13
|
Altech corporation
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 5E-115B 5E-200B 5P-DVB 5E-230B 5E-115B-W 5P-230B |
Die-cast aluminum housing
|
List of Unclassifed Manufacturers
|
| CLE331E |
Aluminum Gallium Arsenide IRED Point source Die
|
Clairex Technologies, Inc
|
| 0936013902 |
GWconnect STD - Standard, Single Lever Coupler, Die-cast Aluminum, with 1 Lever
|
Molex Electronics Ltd.
|
| HT9033 |
CAS Tone Detector
|
Holtek Semiconductor Inc
|
| 0936040176 |
GWconnect Enclosure, Die-cast Aluminum, S-8100 Series, without External Mounting Flanges
|
Molex Electronics Ltd.
|
| RJ11-6NX-X |
(RJ11-xN) UL Recognized CAS Certified
|
CII Technology
|
| KMM5362203C2WG KMM5362203C2W |
2M x 36 DRAM SIMM using 1Mx16 and 1Mx4 Quad CAS, 1K Refresh, 5V
|
SAMSUNG[Samsung semiconductor]
|
| 1212691 |
Replacement die - CF 500/DIE RCI 6-1
|
PHOENIX CONTACT
|
| KMM5364005CKG KMM5364105CKG KMM5364105CK KMM536400 |
4M x 36 DRAM SIMM using 4Mx4 and 16M Quad CAS, 4K/2K, Refresh, 5V 4米36的DRAM上海药物研究所利用4Mx46M四中科院K/2K，刷新，5V
|
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
SAMSUNG[Samsung semiconductor]
|
| KMM5364005CK |
(KMM5364105CK / KMM5364005CK) 4MBx36 DRAM Simm Using 4MBx4 And 16MB Quad Cas
|
Samsung Semiconductor
|
