| PART |
Description |
Maker |
| HEDM-65XX |
Large Diameter (56mm),Housed Two and Three Channel Optical Encoders(大的直径(56mm),含有两个和三个通道的光编码
|
Agilent(Hewlett-Packard)
|
| 0440671002 44067-1002 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0440671403 44067-1403 |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-1602 0440671602 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
| 44067-1202 0440671202 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
| PE1001-7 |
Hermetic Seal Solder Contact With 0.009 Pin Diameter 0.068 Body Diameter And 0.031 Pin Lengthq
|
Pasternack Enterprises, Inc.
|
| PE1001-3 |
Hermetic Seal Solder Contact With 0.018 Pin Diameter 0.112 Body Diameter And 0.18 Pin Length
|
Pasternack Enterprises, Inc.
|
| PE1001-1 |
Hermetic Seal Solder Contact With 0.012 Pin Diameter, 0.1 Body Diameter And 0.18 Pin Length
|
Pasternack Enterprises, Inc.
|
| 44067-1801 0440671801 |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| STK4160MK5 STK4190K5 STK4190MK5 STK4120MK5 STK4110 |
30W x 2-channel power amplifier
2ch./1packge - Power Supply 6W/ch. ~ 100W/ch. THD=0.08%
2ch./1packge, - Power Supply 6W/ch. ~ 100W/ch. THD=0.08%
PIEZO-BUZZER 4.096KHZ 15MM-DIA 9.5NF-30% W/CASING BULK
STK Audio Power Amplifier 沙头角音频功率放大器
TRANSDUCER AUDIO ; Capacitance:14nF; Connector type:2 pin; Diameter, external:28mm; Diameter, panel cut-out:19.05mm; Diameter, pin:0.95mm; Distance, sound level:30cm; Frequency:3500Hz; Frequency, capacitance measurement:1kHz;
|
SANYO[Sanyo Semicon Device]
Sanyo Electric Co.,Ltd.
Sanyo Electric Co., Ltd.
|
| 461-2633 |
Eyelet mount connector pin, .040 (1,02) diameter pin
|
CAMBION Electronic Components
|
| NJG1508F NJG1508F-C1 NJG1508F-C2 NJG1508F-C3 NJG15 |
TV 39C 37#20 2#16 PIN WALL REC
SPDT SWITCH GaAs MMIC
|
New Japan Radio Co., Ltd.
NJRC[New Japan Radio]
|
