Part Number Hot Search : 
ICE65L04 EN5228 SIHFUC20 04030 H810KACA TFS246D S1WBA80D 30725
Product Description
Full Text Search

254322MR - 2.54 x 2.54mm DUAL ROW HEADER EASY BREAKABLE R/A DIP TYPE

254322MR_4897203.PDF Datasheet


 Full text search : 2.54 x 2.54mm DUAL ROW HEADER EASY BREAKABLE R/A DIP TYPE
 Product Description search : 2.54 x 2.54mm DUAL ROW HEADER EASY BREAKABLE R/A DIP TYPE


 Related Part Number
PART Description Maker
0015910120 015-91-0120 71308-0112N 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
Molex Electronics Ltd.
0015910580 015-91-0580 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
Molex Electronics Ltd.
0554011619 55401-1619 2.54mm (.100) Pitch QF-50?/a> Flat Ribbon Cable Header, Dual Row, VerticalShrouded Header with Eject Levers, 16 Circuits, Lead-free
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, VerticalShrouded Header with Eject Levers, 16 Circuits, Lead-free
MOLEX Connector
Molex Electronics Ltd.
D9224-46 D9924-46 D9224-01 D9724-46 D9240-46 D9922 2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin, 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 40-way DIP40, IC SOCKET
DIP22, IC SOCKET
Harwin PLC
HARWIN INC
0015910740 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
Molex Electronics Ltd.
0015800281 70567-0012 15-80-0281 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector
Molex Electronics Ltd.
15-80-0101 70567-0003 A-70567-0003 0015800101 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
Molex Electronics Ltd.
71764-0030 0717640030 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right An
Molex Electronics Ltd.
15-80-0129 0015800129 A-70567-0276 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
Molex Electronics Ltd.
15-80-0109 0015800109 70567-0275 A-70567-0275 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
Molex Electronics Ltd.
0025021022 25-02-1022 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 22 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
Molex Electronics Ltd.
0025021012 25-02-1012 SDA-70204-0325 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
Molex Electronics Ltd.
 
 Related keyword From Full Text Search System
254322MR Series 254322MR fairchild 254322MR datasheet 254322MR filetype:pdf 254322MR Lead forming
254322MR video 254322MR Sipat 254322MR international 254322MR Emitter 254322MR Crystals
 

 

Price & Availability of 254322MR

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
0.081658124923706