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60900 DSW25112 HT2815 CPG54 SMF54A M994AP IRFP460C 32E24
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70246-2402 - 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100") Pitch C-Grid垄莽 Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plati

70246-2402_4886716.PDF Datasheet
 Full text search : 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100") Pitch C-Grid垄莽 Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plati
 Product Description search : 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100") Pitch C-Grid垄莽 Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plati

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