| PART |
Description |
Maker |
| MM70-314-310B2-1 MM70-314-310B2-2 |
TOP SIDE CONTACT - COPPER ALLOY
|
Japan Aviation Electronics Industry, Ltd.
|
| MM50-200B1-1RE MM50-200B1-2RE MM50-200B2-1RE MM50- |
TOP SIDE CONTACT - PHOSPHOR BRONZE
|
Japan Aviation Electronics Industry, Ltd.
|
| 0472490005 |
Cover for Mobile Phone Camera Socket, 8x8, Top Mount, Side Contact Type, Stainless Steel, Lead free
|
Molex Electronics Ltd.
|
| 02-08-1201 |
Crimp Socket Contact; Wire Size (AWG):18-24; Contact Material:Brass; Contact Plating:Gold; Contact Termination:Crimp PHOSPHOR BRONZE, TIN (35) OVER COPPER FINISH, WIRE TERMINAL
|
Molex, Inc.
|
| FI-X20M-NPB FI-X14M-NPB |
FPC SIDE - COPPER ALLOY
|
Japan Aviation Electronics Industry, Ltd.
|
| MTJ-88AX1-FSE MTJ-88TX1 MTJ-88TX1-FSE-PG |
MODULAR TELEPHONE JACKS CATEGORY 5, 5e, SIDE & TOP ENTRY
|
Adam Technologies, Inc.
|
| 52207-2460 |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 24 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
| 52745-1997 0527451997 |
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style,19 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
| HLMP-C027-P0000 HLMP-C608-R00DD HLMP-C025-P0002 HL |
0.5mm contact spacing, 1.0mm height, Top contact, Back flip FPC/FFC connectors; HRS No: 580-1225-5 50; Contact Mating Area Plating: Gold
T-1 3/4 (5 mm) AlInGaP Lamp 的T 1 3 / 45毫米）的AlInGaP
T-13/4 (5mm) AlInGaP Lamp 的T 13 / 4mm）的铝铟镓磷化物
|
Taiwan Semiconductor Co., Ltd.
Avago Technologies, Ltd.
|
| RED3600 RED360 RED300 RED3000 RED RED6 RED600 RED1 |
AC LINE FREQUENCY DIVIDERS
CRIMP PIN, SURE SEAL, PK100; Connector type:Contact, Crimp; Gender:Pin; Termination method:Crimp; Material, contact:Copper alloy; Plating, contact
|
LSI[LSI Computer Systems]
LSI Corporation
|
| 0522071060 52207-1060 |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact Style Receptacle, 10 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
| MTJG-3-667VX2 MTJG-3-667HX2 |
MODULAR TELEPHONE JACKS GANGED JACK, TOP & SIDE ENTRY-TYPE 7
|
Adam Technologies, Inc.
|
|
