| PART |
Description |
Maker |
| CR2430 |
3.0 Volts 4.6 grams (0.16 oz.) 1.3 cubic centimeters (0.08 cubic inch)
|
ENERGIZER[Energizer]
|
| A76 |
1.5 Volts 2.3 grams (0.08 oz.) 0.50 cubic centimeters (0.03 cubic inch)
|
Energizer Battery Company
ENERGIZER[Energizer]
|
| EL2CR5 |
6.0 Volts 39.5 grams (1.39 oz.) 26.0 cubic centimeters (1.6 cubic inch)
|
ENERGIZER[Energizer]
|
| CR1025 |
3.0 Volts 0.7 grams (0.02 oz.) 0.2 cubic centimeters (0.01 cubic inch)
|
ENERGIZER[Energizer]
|
| CR1632 |
3.0 Volts 1.8 grams (0.06 oz.) 0.5 cubic centimeters (0.03 cubic inch) 130 mAh to 2.0 volts
|
Energizer
|
| ACT-S128K32N-055P6Q ACT-S128K32C-055P3Q |
512K X 8 CACHE SRAM MODULE, 55 ns, CPGA66 1.185 X 1.185 INCH, 0.245 INCH HEIGHT, HERMETIC SEALED, PGA-66
512K X 8 CACHE SRAM MODULE, 55 ns, CPGA66 1.085 X 1.085 INCH, 0.160 INCH HEIGHT, HERMETIC SEALED, PGA-66
|
Atmel, Corp.
Analog Devices, Inc.
|
| DAC08Q2/38510 DAC08Q5/38510 |
PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP16 0.250 X 0.875 INCH, HERMETIC SEALED, CERAMIC, DIP-16
|
Analog Devices, Inc.
|
| WS128K32NV-17H1MA WS128K32NV-17H1C WS128K32NV-17H1 |
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp.
White Electronic Designs, Corp.
|
| FTR-F2AK005T FTR-F2AK024T FTR-H2AK024T FTR-B2NA4.5 |
4 Pole (2 FORM C 2 FORM A) Signal Relay for Central Switching/ Data Transmission
|
Fujitsu Component Limited.
|
| PE4543 |
SMA Female Connector Solder Attachment 0.062 inch End Launch PCB, .020 inch x .010 inch Contact
|
Pasternack Enterprises, Inc.
|
|
