| PART |
Description |
Maker |
| AS8FLC1M32BQT-90_IT AS8FLC1M32BQT-90_Q AS8FLC1M32B |
Hermetic, Multi-Chip Module (MCM) 32Mb, 1M x 32, 3.0Volt Boot Block FLASH Array
1M X 32 FLASH 3V PROM, 70 ns, CPGA66 HIP-66
1M X 32 FLASH 3V PROM, 100 ns, CQFP68
|
http://
Austin Semiconductor, Inc
MICROSS COMPONENTS
|
| CYM1828HG-25C |
32K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
|
Intersil, Corp.
|
| DP5Z2MX16PAY3-70I DP5Z2MX16PAI3-70B DP5Z2MX16PAJ3- |
2M X 16 FLASH 5V PROM MODULE, 70 ns, CQCC48 HERMETIC SEALED, CERAMIC, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 70 ns, CQIP48 HERMETIC SEALED, STRAIGHT-LEAD, CERAMIC, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 70 ns, CQCC48 HERMETIC SEALED, J-LEAD, CERAMIC, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 70 ns, CQFP48 HERMETIC SEALED, GULLWING-LEAD, CERAMIC, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 70 ns, CPGA50 DENSE STACK, PGA-50
2M X 16 FLASH 5V PROM MODULE, 120 ns, CQIP48 HERMETIC SEALED, STRAIGHT-LEAD, CERAMIC, SLCC-48
|
Alliance Semiconductor, Corp.
Linear Integrated System, Inc
|
| FDMF8700 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
| OMH410 |
100V Hi-Rel Multi-Chip MOSFET Half-Bridge Module in a MP-3 package
|
International Rectifier
|
| AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30
64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22
256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22
1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22
128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
| WE128K32-XH1X WE128K32-XG2TX WE128K32NP-200H1Q WE1 |
EEPROM MCP
128K X 32 EEPROM 5V MODULE, 200 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 120 ns, CPGA66 1.075 x 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 150 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 140 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 250 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp.
White Electronic Designs, Corp.
|
| DP5Z4MX16PI3-12C |
4M X 16 FLASH 5V PROM MODULE, 120 ns, CQIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
|
Twilight Technology, Inc.
|
| 5962R0622903VYC AT68166FT-YM25-E AT68166FT-YM25-SC |
512K X 32 STANDARD SRAM, 25 ns, CQFP68
Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi- Chip Module
|
E2V TECHNOLOGIES PLC
ATMEL Corporation
|
| MC-7833 MC-7833-AZ |
GaAs MULTI-CHIP MODULE
40 MHz - 870 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
|
NEC
|
| WS512K8L-20CM WS512K8L-20CQA WS512K8-XCX WS512K8-2 |
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32
512Kx8 SRAM MODULE, SMD 5962-92078
|
WEDC[White Electronic Designs Corporation]
|
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