| PART |
Description |
Maker |
| TC2997C |
2.1 GHz 20 W Flange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| LT3D65W LT3E65W LT3H65W LT3K65W LT3S65W |
mm(T-1), Cylinder Type(Thick Flange), Colored Transparency, Tape-packaged LED Lamps for Surface Mount
|
SHARP
|
| TC2182 |
Low Noise Ceramic Packaged PHEMT GaAs FETs
|
Transcom, Inc.
|
| TC2997G |
3.5 GHz 16WFlange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| CM415 |
TUNING FORK CRYSTAL WITH CERAMIC PACKAGED TYPE HIGH-DENSITY SMD TYPE
|
List of Unclassifed Manufacturers
|
| QESM07 QESM07120JO2010FREQ3 |
QUARTZ CRYSTAL RESONATOR, 26 MHz - 54 MHz
SMD 3.2x2.5 Crystal -Ceramic SMD packaged
|
TEMEX COMPONENTS
|
| AM2964B/BQA AM2964B/BUA AM2964BPC AM2964BDMB AM296 |
3 Phase Driver, Inverting Input, 0.8us Deadtime in a 28-pin DIP package; A IR2132 packaged in a 28-Lead SOIC shipped on Tape and Reel
3 Phase Driver, Inverting Input, 2.5us Deadtime in a 28-pin DIP package; A IR2130 packaged in a 28-Lead PDIP
Half Bridge Driver, Soft Turn-On, Separate High and Low Side Inputs, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2108 packaged in a 8-Lead PDIP DRAM控制
3 Phase Driver, Inverting Input, 2.5us Deadtime in a 28-pin DIP package; A IR2130 packaged in a Lead-Free 28-Lead SOIC DRAM控制
Half Bridge Driver, SoftTurn-On, Noninverting Inputs in a 8-pin DIP package; A IR2304 packaged in a 8-Lead SOIC DRAM控制
|
NXP Semiconductors N.V.
|
| D20NP1R4F5PA D12NP0R4F5PA D12NP0R4B5PA D15NP1R2F5P |
CAPACITOR, CERAMIC, 50 V, NP, 0.0000014 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000004 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000012 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000005 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000024 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000006 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000018 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000024 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000009 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.00000045 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000014 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000012 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000011 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000013 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.000001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000011 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.00000035 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000017 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000016 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NS, 0.000002 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, BJ, 0.000043 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PG, 0.00000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PG, 0.00000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PG, 0.00000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PG, 0.00000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PI, 0.0000002 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PI, 0.00000006 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PI, 0.00000006 uF, SURFACE MOUNT CHIP
|
Dielectric Laboratories, Inc.
|
| PB-CMM0511-QT-0000 CMM0511-QT-0G0T CMM0511-QT-0G00 |
5.0-14.0 GHz GaAs MMIC Packaged Driver Amplifier 5.0-14.0 GHz的砷化镓微波单片集成电路封装驱动放大
5.0-14.0 GHz GaAs MMIC Packaged Driver Amplifier 5000 MHz - 14000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
|
Mimix Broadband, Inc.
ATM Electronic, Corp.
|
| KV1913A KV1933A KV1973A KV2143 KV2153 GC1303 KV212 |
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES C BAND, SILICON, HYPERABRUPT VARIABLE CAPACITANCE DIODE
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES C BAND, 1.8 pF, SILICON, ABRUPT VARIABLE CAPACITANCE DIODE
OPTOCOUPLER 10MBPS OC 5-SOP
Tuning Varactors
|
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
| AM29707DC AM29707LC AM29707PC AM29705/BXA AM29705A |
Dual Low Side Driver in a 8-pin DIP package; A IR4427 packaged in a 8-Lead PDIP
High and Low Side Driver, SoftTurn-On, Noninverting Inputs, Separate High and Low Side Inputs in a 8-pin DIP package; A IR2181 packaged in a Lead-Free 8-Lead SOIC
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, All high Voltage Pins on One Side, Programmable 540-5000ns Deadtime in a 14-pin DIP package; A IRS21094 packaged in a Lead-Free 14-Lead SOIC
High voltage, high speed power MOSFET and IGBT driver with dependent high side and low side referenced output channels packaged in a 8-Pin SOIC; A IRS2609DSPBF with Standard Packaging
x4 SRAM
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, All high Voltage Pins on One Side, Programmable 540-5000ns Deadtime in a 14-pin DIP package; A IRS21094 packaged in a Lead-Free 14-Lead PDIP
High and Low Side Driver, SoftTurn-On, Noninverting Inputs, Separate High and Low Side Inputs in a 8-pin DIP package; A IR2181 packaged in a 8-Lead SOIC
x4SRAM
|
|
| ISL4238EIRZ ISL4245EIRZ-T ISL4238E ISL4238EIR ISL4 |
QFN Packaged, 卤15kV ESD Protected, 2.7V to 5.5V, 10Nanoamp, 250kbps/1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown(QFN灏??, 卤15kV ESD ?叉?, 2.7V??5.5V, 10Nanoamp, 250kbps/1Mbps, ?锋????????????S-232?跺???
5V High-Speed RS-232 Transceivers with 0.1uF Capacitors TRIPLE LINE TRANSCEIVER, PQCC32
QFN Packaged, ±15kV ESD Protected, 2.7V to 5.5V, 10Nanoamp, 250kbps/1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown(QFN封装, ±15kV ESD 防护, 2.7V5.5V, 10Nanoamp, 250kbps/1Mbps, 具有自动断电功能的RS-232收发
QFN Packaged, 5kV ESD Protected, 2.7V to 5.5V, 10Nanoamp, 250kbps/ 1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown
QFN Packaged, 【15kV ESD Protected, 2.7V to 5.5V, 10Nanoamp, 250kbps/ 1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown
|
Intersil, Corp.
INTERSIL[Intersil Corporation]
|
|
