| PART |
Description |
Maker |
| FDC40-24S12 FDC40-12S05 FDC40-24D12 FDC40-12D15 FD |
CONN,HEADER,GPFA202-0255A07, 2mm,4 CKT,2 ROW,VERTICAL,15u"A
CONN,HEADER,GPFA202-0355A07, 2mm,6 CKT,2 ROW,VERTICAL,15u"A
PLCC,SMT SOCKET,68-PIN 隔离及规0瓦的模块式DC / DC转换
CONN,HEADER,GPFA202-0655A07, 2mm,12 CKT,2 ROW,VERTICAL,15u" 隔离及规0瓦的模块式DC / DC转换
Isolated and Regulated 40 WATT Modular DC/DC Converters 隔离及规0瓦的模块式DC / DC转换
CONN,HEADER,GPFA202-0855A07, 2mm,16 CKT,2 ROW,VERTICAL,15u" 隔离及规0瓦的模块式DC / DC转换
CONN,IDC,PLUG,50 CONTACTS, 1A,SHROUDED W/O EARS 隔离及规0瓦的模块式DC / DC转换
CONN,HEADER,GPFA202-2555A07, 2mm,50 CKT,2 ROW,VERTICAL,15u" 隔离及规0瓦的模块式DC / DC转换
SOCKET,PLCC,44PIN,SMD 隔离及规0瓦的模块式DC / DC转换
CONN,HEADER,GPFA202-0755A07, 2mm,14 CKT,2 ROW,VERTICAL,15u" 隔离及规0瓦的模块式DC / DC转换
CONN,HEADER,GPFA202-0555A07, 2mm,10 CKT,2 ROW,VERTICAL,15u" 隔离及规0瓦的模块DC / DC转换
CONN,HEADER,GPFA202-2055A07, 2mm,40 CKT,2 ROW,VERTICAL,15u" 隔离及规40瓦的模块式DC / DC转换
|
Astrodyne, Inc.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0015910040 015-91-0040 713080104N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0015910120 015-91-0120 71308-0112N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0015910140 015-91-0140 A713080114N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0554012619 55401-2619 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical Shrouded Header with Eject Levers, 26 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0554014019 55401-4019 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical,Shrouded Header with Eject Levers, 40 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 15-47-7512 0015477512 A-70568-0004 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
|
Molex Electronics Ltd.
|
| 2MBHR-XX-VSG-SMT-P |
DUAL ROW VERTICAL MOUNT BOX HEADER
|
Adam Technologies, Inc.
|
| 0015800281 70567-0012 15-80-0281 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 15-80-0121 A-70567-0004 0015800121 705670004 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
|
