| PART |
Description |
Maker |
| HC55185GCM HC55185GCMZ HC55185GCR HC55185GCRZ HC55 |
VoIP Ringing SLIC; Temperature Range: -40°C to 85°C; Package: 28-PLCC T&R
VoIP Ringing SLIC; Temperature Range: 0°C to 70°C; Package: 28-PLCC T&R TELECOM-SLIC, PQCC28
VoIP Ringing SLIC; Temperature Range: 0°C to 70°C; Package: 32-QFN T&R TELECOM-SLIC, PQCC32
VoIP Ringing SLIC Family
|
Intersil, Corp.
INTERSIL[Intersil Corporation]
|
| AT76C901 |
Wireless VoIP Phone-based on the 802.11 Standard Processor AT76C901 Summary
Wireless VoIP Phone-based on the 802.11 Standard Processor AT76C901 Summary
Wireless VoIP Phone based on the 802.11 Standard Processor.
|
ATMEL[ATMEL Corporation]
|
| BU1561GV |
Built-in JPEG Codec, SXGA Camera Module Interface, and QCIF LCD controller interface
|
Rohm
|
| ML7074-001 ML7074-001GA |
VoIP CODEC
|
OKI electronic componets
|
| BCM4318 BCM1161 |
MOBILE VOIP PROCESSOR
|
Broadcom Corp.
Broadcom Corporation.
|
| MSP2015 |
MSP for VoIP Gateways and Phones, Wired and Wireless
|
PMC-Sierra, Inc
|
| ZXMN15A27K |
MOSFETs optimised for Voice over Internet Protocol (VoIP)
|
Diodes Incorporated
|
| TF1107 |
SOLID STATE I/O INTERFACE MODULE DC INPUT MODULE
|
TOSHIBA
|
| MSP2020 |
MSP for Secure VoIP Gateways and Phones Wired and Wireless
|
PMC-Sierra
|
| TFDU5307-TR1 TFDU5307-TT1 |
SPECIALTY INTERFACE CIRCUIT, SMA8
IC SPECIALTY INTERFACE CIRCUIT, SMA8, 8.50 X 2.90 MM, 2.50 MM HEIGHT, ROHS COMPLIANT, MODULE, 8 PIN, Interface IC:Other
|
VISHAY SEMICONDUCTORS
|
