| PART |
Description |
Maker |
| CA-PLCC20-Z-M-T-01 |
Carrier Adapter 20 Position PLCC ZIF Socket with test points to mini-grid array interface. Pin mapping is 1:1.
|
Ironwood Electronics.
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| 546-93-108-12-101-035 546-93-108-12-101-036 |
Pin Grid Array sockets Press-fit terminations
|
Precid-Dip Durtal SA
|
| FLGA |
Fine Pitch Land Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| BAR66 Q62702-A1473 |
Silicon PIN Diode Array (Surge protection device Two PIN diodes, series configuration)
From old datasheet system
|
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC |
Ball Grid Array (BGA, 1.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| FBGA-SD |
Fine Pitch Ball Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| NP352-04808 NP352-04811 NP352-04813 NP352-1849-35 |
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
| CM1401-03CP CM1401-03CS |
4 Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB in Chip Scale Package with Optiguard™ Coating (CSPEMI307A pin ...
|
California Micro Devices Corp
|
