| PART |
Description |
Maker |
| KTD2005 |
Low ON resistance 2.5V drive Mounting height 1.1mm Composite type, facilitating high-density mounting.
|
TY Semiconductor Co., Ltd
|
| HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC815 PC815-SERIES |
High Sensitivity, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| ISP815 ISP815X ISP825 ISP845 ISP845X ISP825X |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
ISOCOM[ISOCOM COMPONENTS]
|
| TLP621-2 TLP621-4 TLP621 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| ISP521-1 ISP521-1X ISP521-108 ISP521-2 ISP521-2X I |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| IS181 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| LTV-355T |
Hybrid substrates that require high density mounting Programmable controllers
|
光宝科技股份有限公司
Lite-On Technology Corporation
|
