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3E26 - Material specification

3E26_4633537.PDF Datasheet


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MC12U256HBFA-0QC00 MC1GU032HCYA-0QC00 MC1GU016HCFB CABLE, 9505, 5PAIR, 30.5M; Cores, No. of:10; Conductor make-up:7/32AWG; Area, conductor CSA:0.2mm2; Diameter, External:7.34mm; Material, secondary insulation:PVC; Length, Reel (Imperial):100ft; Colour, secondary insulation:Chrome; RoHS Compliant: Yes
Shielded Paired Cable; Number of Conductors:2; Conductor Size AWG:24; No. Strands x Strand Size:7 x 32; Jacket Material:Polyvinylchloride (PVC); Shielding Material:Aluminum Foil/Polyester Tape; Number of Pairs:1 RoHS Compliant: Yes
CABLE, 9506, 6PAIR, PER M; Cores, No. of:12; Conductor make-up:7/32AWG; Area, conductor CSA:0.2mm2; Diameter, External:7.34mm; Material, secondary insulation:PVC; Colour, secondary insulation:Chrome; Alpha type number:5476C RoHS Compliant: Yes
AC MEXICO
Shielded Paired Cable; Number of Conductors:10; Conductor Size AWG:24; No. Strands x Strand Size:7 x 32; Jacket Material:Polyvinylchloride (PVC); Number of Pairs:5; Impedance:75ohm; Leaded Process Compatible:Yes; Voltage Nom.:300V RoHS Compliant: Yes
Film Capacitor; Capacitor Type:Motor Start/Motor Run; Voltage Rating:370VAC; Capacitor Dielectric Material:Polypropylene; Capacitance:3uF; Capacitance Tolerance: 10%; Lead Pitch:20.6mm; Leaded Process Compatible:Yes; Series:MPF RoHS Compliant: Yes
Film Capacitor; Capacitor Type:Motor Start/Motor Run; Voltage Rating:370VAC; Capacitor Dielectric Material:Polypropylene; Capacitance:4uF; Capacitance Tolerance: /- 10%; Lead Pitch:20.64mm; Package/Case:32; Series:MPF
The HFC-S mini is not recommended for new projects. Please use XHFC-1SU instead. 多媒体卡规格
MultiMediaCard Specification 多媒体卡规格
   MultiMediaCard Specification
http://
SAMSUNG SEMICONDUCTOR CO. LTD.
Cologne Chip
Samsung Semiconductor Co., Ltd.
EE13-K-H-8P-SW EE13-KH-8P-SW BOBBIN MATERIAL: PHENOLIC PIN MATERIAL: CP WIRE UL REC. UL 94V-0
FERYSTER Inductive Components Manufacturer
FERYSTER Inductive Comp...
K4S641632H-UC60 K4S641632H-UC70 K4S641632H-UC75 K4 64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 64芯片与内存规格铅54 TSOP-II免费(符合RoHS
D-Subminiature Connector; Gender:Female; No. of Contacts:50; Contact Termination:IDC; D Sub Shell Size:DB50; Body Material:Steel; Contact Plating:Gold Over Nickel RoHS Compliant: Yes 64芯片与内存规格铅54 TSOP-II免费(符合RoHS
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free 64芯片与内存规格铅54 TSOP-II免费
DELTA CONN 14POS PLUG W/O INSERT
DELTA CONN 14 POS PLUG BAIL LOCK
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
XC95288XV DS050 XC95288XV-7TQ144I XC95288XV-10CS28 High-Performance CPLD
From old datasheet system
Advance Product Specification
D-Subminiature Connector; Gender:Female; No. of Contacts:15; Contact Termination:Through Hole; D Sub Shell Size:DB15; Body Material:Steel; Body Plating:Zinc; Contact Plating:Gold Flash; Mounting Type:Through Hole RoHS Compliant: Yes
D-Subminiature Connector; Gender:Male; No. of Contacts:15; Contact Termination:Crimp; D Sub Shell Size:DB15; Body Material:Steel; Body Plating:Zinc; Contact Plating:Gold RoHS Compliant: Yes
LJT 10C 10#20 PIN PLUG
DSUB 15 M SOD FLOA G
Metal Connector Backshell; Enclosure Material:Steel; Connector Type:Right-Angle; Leaded Process Compatible:No; No. of Positions:25; Peak Reflow Compatible (260 C):No RoHS Compliant: No
DSUB B/S DB 90DEG METAL 1 FLASH PLD, 10 ns, PQFP144
DSUB B/S DB STRT METAL 1 FLASH PLD, 10 ns, PQFP208
Plastic Connector Backshell; Enclosure Material:Steel; Enclosure Color:Yellow; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No FLASH PLD, 10 ns, PQFP208
XILINX[Xilinx, Inc]
Xilinx, Inc.
2SC1816 SPECIFICATION TRANSISTORSS,DIODES
From old datasheet system
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ETC[ETC]
 
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