| PART |
Description |
Maker |
| HT2MOA3S20 |
HITAGTM2 Chip Module
|
Philips Semiconductors
|
| HDG12864F-3 |
128x64 GRAPHICS Chip-On-Glass Parallel interface LCD DISPLAY MODULE 128x64图形芯片玻璃上并行接口液晶显示模
128 x 64 Graphics Chip On Glass LCD Display Module
|
Electronic Theatre Controls, Inc.
Hantronix,Inc
|
| IBM11N4845BB IBM11N4845CB |
4M x 72 Chip-Kill Protect ECC-on-DIMM Module(4M x 72 带纠错代码保护的小外形双列直插动态RAM模块) 4米72片，杀死保护ECC的上内存模块米72带纠错代码保护的小外形双列直插动态内存模块）
4M x 72 Chip-Kill Protect ECC-on-DIMM Module(4M x 72 甯????唬????ょ?灏??褰㈠?????????AM妯″?)
|
International Business Machines, Corp.
IBM Microeletronics
|
| JE93I9HTR5 JE9 JE9112HR1 JE9112HR2 JE9112HR3 JE911 |
Digital Media System-on-Chip (DMSoC) 338-NFBGA 大功率磁保持继电
2.0mV Quad Ultra Micropower Rail-to-Rail CMOS Operational Amplifier, 24L SOIC 大功率磁保持继电
HIGH POWER LATCHING RELAY 大功率磁保持继电
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 4.6mJ, 68msec@25mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 55mJ, 88msec@150mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 8.3mJ, 80msec@25mA
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 30mJ, 75msec@150mA
SOIC socket added to Adapter Module
|
Hongfa Relay
???瀹???靛０?′唤??????
Xiamen Hongfa Electroacoustic Co., Ltd.
厦门宏发电声股份有限公司
HONGFA[Hongfa Technology]
|
| V048F480T006 P048F048M24AL P048F048T24AL V040F033T |
VI Chip - PRM-AL Pre-Regulator Module
|
VICOR[Vicor Corporation]
|
| FDMF8705 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
| B048K030T21 B048K030M21 |
VI Chip - BCM Bus Converter Module
|
VICOR[Vicor Corporation]
|
| B048L120T10 B048F120T10 B048G120T10 B048K120T10 |
VI Chip - BCM Bus Converter Module
|
VICOR[Vicor Corporation]
|
| B352F110T24 |
VI Chip - BCM Bus Converter Module
|
VICOR[Vicor Corporation]
|
| B352F110M24 |
VI Chip - BCM Bus Converter Module
|
Vicor Corporation
|
| ATZB-S1-256-3-0-C-14 |
ZigBit 2.4GHz Single chip Wireless Module
|
ATMEL Corporation
|
