PART |
Description |
Maker |
ISRVGC0118 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
JRGC0678 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
IVYC0128 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
JYOC0195 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
ISUGC0118 |
miniature chip type designed for surface mounting
|
IDEA.lnc.
|
IUGC0428 |
miniature lens type designed for surface mounting
|
IDEA.lnc.
|
IVGC0178 |
miniature lens type designed for surface mounting
|
IDEA.lnc.
|
JRGC0128 |
right-angle bi-color miniature chip type
|
IDEA.lnc.
|
T77S1D10-24 T75S1D112-05 2-1393222-9 2-1393223-8 |
Sensitive, Low Profile, Hi-Current Relay Designed to Meet International Standards 10 Amp, PC Board Miniature Relay
|
Tyco Electronics
|
AM29824DM AM29826DM AM29822DM AM29822LMB AM29822DM |
9-Bit D-Type Flip-Flop Reference Design kit for the iP1206 a 300kHz, 30A Synchronous Buck Converter; A IRDCIP1206-B with Standard Packaging Intelligent Power Module. Gate Driver IC integrated with a half bridge FredFET Designed for sub 250W Motor Drive applications in a 9-Lead SIP. RDSon of 1.0 Ohm; A IR3101 with Standard Packaging 10位D型触发器 IR1150 Demo Board designed for use in continuous conduction mode boost converter applications for power factor correction and harmonic current reduction.; A IRAC1150-300W with Standard Packaging 10位D型触发器 Octal D-Type Flip-Flop 八路D类触发器
|
Toshiba, Corp. Electronic Theatre Controls, Inc. ITT, Corp. ATM Electronic, Corp.
|
C16051 |
Asymmetric IESNA Type I (short) beam designed for tilted poles
|
Ledil, Inc.
|