| PART |
Description |
Maker |
| IC280-720-106 IC280-256-211 IC280-69605.AC-08327 I |
Ball Grid Array (FBGA / CSP / LGA)
|
Yamaichi Electronics Co., Ltd.
|
| FLGA |
Fine Pitch Land Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| CHC-CH4ALF-01-1002-D-A CHC-CH8ALF-01-1002-D-A CHC- |
Precision Ceramic Ball Grid Arrays
|
IRC - a TT electronics Company.
|
| AS4C64M16D3A-12BAN |
96 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
| AS4C64M16D3A-12BIN AS4C64M16D3A-12BCN |
96 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
| NP89-21004-G4-BF NP89-12110-G4-BF NP89-12110MF-G4- |
Pin Grid Array / Zero Insertion Force (PGA / ZIF)
|
Yamaichi Electronics Co., Ltd.
|
| K4M28163PF K4M28163PF-F75 K4M28163PF-R K4M28163PF- |
2M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 200万16 × 4银行4FBGA移动SDRAM
8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 0.80 MM PITCH, LEAD FREE, FBGA-54
8M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 0.80 MM PITCH, LEAD FREE, FBGA-54
8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 0.80 MM PITCH, FBGA-54
|
Samsung Electronic
Samsung Semiconductor Co., Ltd.
Data Device, Corp.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| NP236-102002-1 NP236-102002-2 |
Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)
|
Yamaichi Electronics Co., Ltd.
|
| WSFX054-SERIES XSFX054-SERIES YSFX054-SERIES WSFX0 |
Cyclone II FPGA 35K FBGA-484
Interface IC 接口IC
CYCLONE III FPGA 25K 324-FBGA 接口IC
|
Ironwood Electronics
DB Lectro, Inc.
|
