| PART |
Description |
Maker |
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| LTV817 LTV827 LTV847 |
HIgh Density Mounting Type Photocoupler
|
TMT[Taiwan Memory Technology]
LITEON
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC817B PC817C PC827 PC-817 PC817A PC847 PC837 PC81 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
Sharp Electrionic Compo...
SHARP[Sharp Electrionic Components]
Sharp Corporation
|
| HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| PC861 |
High Collector-emitter Voltage/ High Density Mounting Type Photocoupler
High Collector-emitter Voltage High Density Mounting Type Photocoupler
High Collector-emitter Voltage, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| IS181 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| TIL199A |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
N.A.
|
| IS354 |
HIGH DENSITY MOUNTING AC INPUT, PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
Electronic Theatre Controls, Inc.
|
