| PART |
Description |
Maker |
| CYM1828HG-25C |
32K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
|
Intersil, Corp.
|
| STA8058 |
Teseo high performance GPS multi chip module (MCM)
Teseo⑩ high performance GPS multi chip module (MCM)
|
STMicroelectronics
|
| ROK104022 ROK104001 ROK104021 |
Bluetooth MULTI CHIP MODULE
|
Infineon Technologies A...
Infineon Technologies AG
|
| TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| CMCM |
Ceramic Multi-Chip Module Package
|
Amkor Technology, Inc.
|
| FDMF6700 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
| AT68166FT-YM25-E AT68166FT-YM25-SCC AT68166FT-YS18 |
Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi-Chip Module
|
ATMEL Corporation
|
| 585-3211 585-3213 585-3215 585-3221 585-3225 585-3 |
Multi-Chip BASED LED T1 3/4 Bi-Pin
585 SERIES BASED LEDs-MULTI-CHIP SINGLE COLOR DISPLAY CLUSTER, RED, 5.9 mm
|
Dialight Corporation
Dialight PLC
|
| AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30
64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22
256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22
1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22
128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
| SMFLHP283R3S SMFLHP2805D SMFLHP2812D SMFLHP2805D07 |
Parallel operation with current share, up to 3 units (228 watts)
2-OUTPUT 100 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12
2-OUTPUT 80 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12
|
Interpoint Corporation Company
Standard Power
|
| SKY77441 |
Multi-Mode / Multi-Band PA Module
|
Skyworks Solutions Inc.
|
