| PART |
Description |
Maker |
| SDM0230CSP |
0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE
|
Diodes Incorporated
|
| FCSP1H40LTR FCSP1H40LTR11 |
FlipKY,1 A Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| ADG783BCP ADG783 ADG783BCPZ-REEL ADG782 |
CMOS, Low Voltage 2.5 ohms Quad SPST Switches in Chip Scale Package
CMOS, Low Voltage 2.5 Ohm Quad SPST Switches in Chip Scale Package; Package: LFCSP (4x4mm); No of Pins: 20; Temperature Range: Industrial QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CQCC20
|
AD[Analog Devices]
Analog Devices, Inc.
|
| PACDN1408C PACDN1408CR PACDN2408CR PACDN2408C |
ESD PROTECTION ARRAYS/ 8 CHANNEL/ CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS, 8 CHANNEL, CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS 8 CHANNEL CHIP SCALE PACKAGE
|
CALMIRCO[California Micro Devices Corp]
|
| ADF4602BCPZ-RL |
Single-Chip, Multiband 3G Femtocell Transceiver; Package: LFCSP: Leadform Chip Scale; No of Pins: 40; Temperature Range: Ind TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC40
|
Analog Devices, Inc.
|
| ADG758 ADG759 ADG759BCP ADG758BCP |
3 OHM, 4-/8-CHANNEL MULTIPLEXERS IN CHIP SCALE PACKAGE
|
AD[Analog Devices]
|
| NP383-28804-N NP383-28804-P NP383-84107-N NP383-84 |
Chip Scale Package -TH (CSP, 0.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| FCSP0530ETR |
chip scale packaging to deliver Schottky diodes
|
Vishay Siliconix
|
| CSPRC032A |
EMI/RFI Filter Network, Chip Scale Package
|
California Micro Devices Corp
|
| MAX16072RSD MAX16073RSD MAX16074RSD MAX16072 MAX16 |
楼矛P Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package
μP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package
|
Maxim Integrated Products
|
| 28F3204C3 |
3 V Advanced Stacked Chip Scale Package Memory(3V高级堆芯片封装存储器) 3伏高级堆叠芯片级封装存储器（3V的高级堆芯片封装存储器）
|
Intel, Corp.
|
