| PART |
Description |
Maker |
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
| POWERSO-10 |
10LEADS POWER SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| AP9451GG-HF AP9451GG-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2318GEN-HF AP2318GEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2313GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AK18D300-TSOP AK14D300-TSOP AK20D300-TSOP |
Thin Small Outline Package TSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| LC33832M-70 LC33832P-70 LC33832M-10 LC33832PL-10 L |
Small outline package version of the LC33832SL
x8 Pseudo-Static RAM
|
Sanyo Semiconductor
|
| SOT108-1 |
SO14: plastic small outline package; 14 leads; body width 3.9 mm
|
NXP Semiconductors
Philips Semiconductors
|
| AP2310GN-HF |
Simple Drive Requirement, Small Package Outline, Surface Mount Device
|
Advanced Power Electronics Corp.
|
