| PART |
Description |
Maker |
| PX5410 |
Multi-Rate VCSEL Driver
|
Zarlink Semiconductor Inc
|
| HFE4081-321 HFE4082-321 |
Attenuated VCSEL with Back Monitor Photodiode - VCSEL Anode Common
|
Finisar Corporation.
|
| SLD1332V |
670nm, 500mW LASER DIODE
|
SONY[Sony Corporation]
|
| W78M32V-XBX W78M32V70BI |
8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package
|
White Electronic Design...
|
| W764M32V120SBM W764M32V-XSBX W764M32V100SB |
64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory
|
White Electronic Design...
|
| W764M32V120SB W764M32V100SB W764M32V-XSBX W764M32V |
64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory
|
WEDC[White Electronic Designs Corporation]
|
| MP2B5038 MP2B5085 MP2B5052 MP2B5150 |
A multi chip power device for a Multi-Oscillated Current Resonant type Converter
|
Fuji Electric
|
| SKY77604 |
Multi-Mode / Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets
|
Skyworks Solutions Inc.
|
| M39P0R9070E2 M39P0R9070E2ZADE M39P0R9070E2ZADF |
256 or 512Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package
|
Numonyx B.V
|
| S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| CE201210-2N2D CE201210-1N8D CE201210-1N5D CE201210 |
Multi-Layer Chip Inductors
MAGNETICS MULTILAYER CHIP INDUCTOR
|
Bourns Electronic Solutions
Bourns, Inc.
|
