| PART |
Description |
Maker |
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| IXLF19N250A |
High Voltage IGBT 19 A, 2500 V, N-CHANNEL IGBT
|
IXYS, Corp.
|
| 5SMY12M1200 |
IGBT-Die
|
The ABB Group
|
| 5SMX12M1273 |
IGBT-Die
|
The ABB Group
|
| 5SMX12M6500 |
IGBT-Die
|
The ABB Group
|
| IRG4CC20UB |
IRG4CC20UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC40KB |
IRG4CC40KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC30FB |
IRG4CC30FB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC10KB |
IRG4CC10KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC50FB |
IRG4CC50FB IGBT Die in Wafer Form
|
International Rectifier
|
