| PART |
Description |
Maker |
| DR331-2-152 DR331-2-105 DR331-2-102 DR331-2-222 DR |
DR331-2 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 1.5µH. Rated Current 2.8 Amps. Operating Temp. -40°C to 85°C. Size: 6.60mm x 4.45mm x 2.92mm.
DR331-2 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 1000µH. Rated Current 0.07 Amps. Operating Temp. -40°C to 85°C. Size: 6.60mm x 4.45mm x 2.92mm.
DR331-2 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 1.0µH. Rated Current 2.9 Amps. Operating Temp. -40°C to 85°C. Size: 6.60mm x 4.45mm x 2.92mm.
DR331-2 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 2.2µH. Rated Current 2.4 Amps. Operating Temp. -40°C to 85°C. Size: 6.60mm x 4.45mm x 2.92mm.
DR331-2 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 22µH. Rated Current 0.80 Amps. Operating Temp. -40°C to 85°C. Size: 6.60mm x 4.45mm x 2.92mm.
1 ELEMENT, 10 uH, GENERAL PURPOSE INDUCTOR, SMD
|
DATATRONIC DISTRIBUTION INC
|
| DR331-1-103 DR331-1-102 42-331-1-223 42-331-1-684 |
DR331-1 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 10µH. Rated Current 3.9 Amps. Operating Temp. -40°C to 85°C. Size: 12.95mm x 9.40mm x 5.21mm.
DR331-1 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 1.0µH. Rated Current 6.8 Amps. Operating Temp. -40°C to 85°C. Size: 12.95mm x 9.40mm x 5.21mm.
1 ELEMENT, 22 uH, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 680 uH, GENERAL PURPOSE INDUCTOR, SMD
DR331-1 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 22µH. Rated Current 2.7 Amps. Operating Temp. -40°C to 85°C. Size: 12.95mm x 9.40mm x 5.21mm.
DR331-1 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 15µH. Rated Current 3.1 Amps. Operating Temp. -40°C to 85°C. Size: 12.95mm x 9.40mm x 5.21mm.
DR331-1 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 33µH. Rated Current 2.1 Amps. Operating Temp. -40°C to 85°C. Size: 12.95mm x 9.40mm x 5.21mm.
DR331-1 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 100µH. Rated Current 1.3 Amps. Operating Temp. -40°C to 85°C. Size: 12.95mm x 9.40mm x 5.21mm.
1 ELEMENT, 3.3 uH, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 6.8 uH, GENERAL PURPOSE INDUCTOR, SMD
DR331-1 Series Unshielded SMD Inductor; Low Profile Surface Mount Design. Inductance 68µH. Rated Current 1.5 Amps. Operating Temp. -40°C to 85°C. Size: 12.95mm x 9.40mm x 5.21mm.
|
DATATRONIC DISTRIBUTION INC
|
| B82500-C-A8 B82500 B82500-C-A10 B82500-C-A2 B82500 |
VHF chokes with ferrite core Rated voltage 250 V dc/ac Rated current 0,2 to 2 A Rated inductance 120 to 3900 mH
|
EPCOS[EPCOS]
|
| B82500-C-A10 B82500-C-A2 B82500-C-A8 B82500-C-A5 |
VHF chokes with ferrite core Rated voltage 250 V dc/ac Rated current 0,2 to 2 A Rated inductance 120 to 3900 mH
|
EPCOS AG
|
| AVC06S04 AVC06Y05 AVC06D04 AVC06D05 AVC06F05 AVC06 |
20 Watts Embedded Power
20w Ultra Low Profile - 6.0mm
DC-DC / Ultra Low Profile Non-Isolated
|
Emerson Network Power
ASTEC[Astec America, Inc]
|
| 25C320E/P 25C320E/SN 25C320E/ST 25C320E/ST14 25LC3 |
Fuses, 750mA 125V F CHIP 1206 32K的SPI总线串行EEPROM
Fuses, 2A 125V F CHIP 1206 32K的SPI总线串行EEPROM
SENSOR REFLECTIVE OBJECT 50MA 32K的SPI总线串行EEPROM
LED 525NM ROUND GREEN 3MM 32K的SPI总线串行EEPROM
32K SPI Bus Serial EEPROM 32K的SPI总线串行EEPROM
Fuses, 4A 125V F CHIP 1206 32K的SPI总线串行EEPROM
Fuses, 5A 125V F CHIP 1206
IC Socket Test Clip Connector Type:Plunger Type RoHS Compliant: Yes
SENSOR PHOTOLOGIC REFLECTIVE
Transformers Only Module
Connector Adapter; Convert From:Phone Jack; Convert To:Double Banana Plug; Body Material:Brass; Body Style:Straight RoHS Compliant: Yes
Fuses, 375mA 125V F CHIP 1206
Binding Post; Current Rating:3A; Body Material:Phosphor Bronze; Color:Black; Voltage Rating:2500V
Fuses, 1.25A 125V F CHIP 1206
Fuses, 1A 125V F CHIP 1206
Fuses, 3.5A 125V F CHIP 1206
Filter Module w/out Resistor Network
Fuses, 1.5A 125V F CHIP 1206
Fuses, 2.5A 125V F CHIP 1206
|
Microchip Technology, Inc.
Microchip Technology Inc.
|
| DBCFG1QB200 DBCFG1QB315 DBCFG1QB100 DBCFG1QB250 DB |
FUSES 5x20mm GLASS FUSES - QUICK BLOW
|
http://
Dubilier
|
| DBCFC2QB200 DBCFC2QB315 DBCFC2QB100 DBCFC2QB250 DB |
FUSES 1 x CERAMIC FUSES - QUICK BLOW 1/4 1/4
|
Dubilier
|
| HM7719007LTTR HM7729007LTTR HM77-33010ALF HM77-340 |
Low Profile Surface Mount Inductors 1 ELEMENT, 77 uH, GENERAL PURPOSE INDUCTOR, SMD
Low Profile Surface Mount Inductors 1 ELEMENT, 114 uH, GENERAL PURPOSE INDUCTOR, SMD
Low Profile Surface Mount Inductors 1 ELEMENT, 115 uH, GENERAL PURPOSE INDUCTOR, SMD
Low Profile Surface Mount Inductors 超薄表面贴装电感
Low Profile Surface Mount Inductors 1 ELEMENT, 1.01 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
BI Technologies Corporation
BI Technologies, Corp.
|
| MRF03-6R-SMT-2 MRF03 MRF03-6P-0.8D MRF03-6P-0.8D-2 |
SMT Low-Profile Coaxial Multiple Contact Connectors
SMT Low-Profile Coaxial Multiple Contact Connectors
2.54mm Pitch DIL Horizontal PC Tail Socket Assembly, tin, 36 36-way 贴片低轮廓同轴连接器多联
SMT Low-Profile Coaxial Multiple Contact Connectors 贴片低轮廓同轴连接器多联
|
HIROSE[Hirose Electric]
Hirose Electric USA, INC.
http://
HIROSE ELECTRIC Co., Ltd.
|
