PART |
Description |
Maker |
ILD1-009 |
SURFACE MOUNT LEAD BEND OPTIONS 表面贴装铅弯曲选项
|
SIEMENS AG
|
BL-B2134N |
LED GaP/GaP Green Low current requirement High efficiency.
|
BRIGHT LED ELECTRONICS CORP
|
BL-B2134-1-L |
LED GaP/GaP Green Low current requirement High efficiency.
|
Bright LED Electronics Corp.
|
BL-B2134G-1 |
LED GaP/GaP Green Low current requirement High efficiency.
|
BRIGHT LED ELECTRONICS CORP
|
BL-CX1336M |
LED GaP/GaP Hi-Eff Green Low power consumption.
|
BRIGHT LED ELECTRONICS CORP
|
BL-B2133N |
GaP/GaP Green Low current requirement High efficiency
|
BRIGHT LED ELECTRONICS CORP
|
BL-B5134 |
LED GaP/GaP Bright Red Low current requirement.
|
BRIGHT LED ELECTRONICS CORP
|
BL-BX13V1F |
LED GaP/GaP Hi-Eff Green Low current requirement.
|
BRIGHT LED ELECTRONICS CORP
|
BL-B5330M |
LED GaP/GaP Bright Red Low current requirement.
|
BRIGHT LED ELECTRONICS CORP
|
BL-B45V1 |
LED GaP/GaP Hi-Eff Red Low current requirement.
|
BRIGHT LED ELECTRONICS CORP
|
BA-10H1UD |
bright red chips, which are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|