| PART |
Description |
Maker |
| SSB-COB6363AW |
63mm x 63mm WIEW AREA, CHIPS ON BOARD LED BACKLIGHT 605mm AMBER, 100CHIPS 4.1V 500mA
63mm x 63mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 605NM AMBER, 100CHIPS 4.1V
|
LUMEX INC.
List of Unclassifed Manufacturers
ETC
|
| 0879371600 87937-1600 |
2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25μm (10μ) Gold(Au) Selective Plating, 17.63mm (.694) Stacking Height
MOLEX Connector
|
Molex Electronics Ltd.
|
| SSB-COB11565GW |
115mm x 65mm VIEW AREA, CHIPS ON BOARD LED BACKLIGHT, 565mm GREEN, 220 CHIPS, 4.2V 1100mA
115mm x 65mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565NM green
|
List of Unclassifed Manufacturers
LUMEX INC.
ETC
|
| D667 PSB-64 |
PCI-SCI Bridge Chips for System Area Networks
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| SSB-COB13340GW |
133mm x 40mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN, 132 CHIPS, 4.2V 660mA
133mm x 40mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565NM green
|
List of Unclassifed Manufacturers
LUMEX INC.
ETC
|
| SSB-COB7540GW-C |
75mm x 40mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN, 70 CHIPS, 20.5V 70mA
75mm x 40mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565NM green
|
http://
ETC
|
| BM-10EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED/YELLOW GREEN, 30.48 mm
|
BRIGHT LED ELECTRONICS CORP
AMERICAN BRIGHT OPTOELECTRONICS CORP
|
| S997911 |
CCD area image sensor TDI operation / large active area CCD
|
Hamamatsu Corporation
|
| SSB-COB13340SYW-B |
SINGLE COLOR DISPLAY CLUSTER, SUPER YELLOW, 133 mm
133mm x 40mm V.A. SUPER YELLOW LED BACKLIGHT CHIPS ON BOARD, 132 CHIPS, 4.2V 660mA
133mm x 40mm V.A. SUPER YELLOW LED BACKLIGHT, CHIPS ON BOARD, 132 CHIPS, 4.2V 660mA
|
ETC
LUMEX INC.
List of Unclassifed Manufacturers
|
| BM-41EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG88MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| TNPW2010 TNPW0805 TNPW1206 TNPW0402 TNPW1210 TNPW2 |
Ultra-stable thin film technology; Pulse resistant;
Thin Film Flat Chip Resistors;
High-Stability
Thin Film, Rectangular, Resistor Chips
Thin Film/ Rectangular/ Resistor Chips
|
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
