| PART |
Description |
Maker |
| TFS868 |
Development specification
|
VECTRON[Vectron International, Inc]
|
| TFS942 |
Development Specification
|
ANALOGICTECH[Advanced Analogic Technologies]
|
| TFS915H |
Development specification
|
Vectron International, Inc
|
| ST7MDT1-110 ST7MDT1-220 ST7MDT1-DVP ST7MDT1-UK 613 |
MDT1-DVP LOW COST ST7 DEVELOPMENT KIT DATASHEET
From old datasheet system
A LOW-COST DEVELOPMENT PACKAGE INCLUDING A FULL REAL-TIME EMULATION BOARD
MDT1-DVP LOW COST ST7 DEVELOPMENT KIT DATASHEET
|
意法半导
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
|
| CONFIG2 CONFIG0 CONFIG1 DSUMFT311EV |
The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.
|
Future Technology Devices International Ltd.
|
| ST7MDT2 ST7MDT2-110 ST7MDT2-220 ST7MDT2-DVP ST7MDT |
A Low-Cost Development Package Including A Full Real-Time Emulation Board(低价格开发软件包)
MDT2-DVP LOW COST ST7 DEVELOPMENT KIT DATASHEET
MOSFET; Transistor Polarity:Dual N/P Channel; Drain Source Voltage, Vds:30V; Continuous Drain Current, Id:51A; On-Resistance, Rds(on):0.36ohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:6-TSOP; Drain-Source Breakdown Voltage:30V
From old datasheet system
MDT2-DVP LOW COST ST7 DEVELOPMENT KIT DATASHEET
|
意法半导
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
|
| UM245R |
USB-Parallel FIFO Development Module Incorporating FTDIChip-ID?/a> Security Dongle
USB-Parallel FIFO Development Module Incorporating FTDIChip-IDSecurity Dongle
USB-Parallel FIFO Development Module Incorporating FTDIChip-ID⑩ Security Dongle
|
Future Technology Devices International Ltd.
|
| Z8F082A |
Development Kit
|
Zilog, Inc.
|
| MPC8250VR MPC8250 |
CodeWarrior Development Studio
|
FREESCALE[Freescale Semiconductor, Inc]
|
| VNCLO-SHLD1A VNCLO-MB1A VNCLO-PSU-EU VNCLO-PSU-UK |
Vinculo Development Module
|
Future Technology Devices International Ltd.
|
| RJU003N03 |
WLAN Development Platforms
|
Rohm CO.,LTD.
|
