| PART |
Description |
Maker |
| LT1P53A LT1E53A LT1H53A LT1S53A LT1D53A LT1K53A |
3.3X2.9mm, 1.1mm Thickness,Milky Diffusion Chip LED Devices
3.3x2.9mm, 1.1mm Thickness, Milky Diffusion Chip LED Devices
|
Sharp Corporation
SHARP[Sharp Electrionic Components]
|
| LT1ET53A |
3.3X2.9mm, 1.1mm Thickness, Milky Diffusion, Dichromatic Chip LED Devices
|
Sharp Electrionic Components
|
| STW9Q14B |
Lead Frame type LED PKG size:5.6*3.0 thickness 0.9mm
|
Seoul Semiconductor
|
| LT1W67A |
1616 Size, 0.8mm Thickness, Compact Full Color Leadless Chip LED Device
1616 Size/ 0.8mm Thickness/ Compact Full Color Leadless Chip LED Device
|
SHARP[Sharp Electrionic Components]
|
| DF26A1.7-9CP-1.1V DF26A1.2-09CP-1.1V DF26A1.2-16CP |
Coaxial Cable; Coaxial RG/U Type:59; Impedance:75ohm; Conductor Size AWG:25; No. Strands x Strand Size:19 x 37; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes RoHS Compliant: Yes 1.1mm的超薄沥青压缩器
1.1mm Pitch Low Profile Compression Connectors 1.1mm的超薄沥青压缩器
|
HIROSE ELECTRIC Co., Ltd.
Hirose Electric USA, INC.
HIROSE[Hirose Electric]
|
| 35408-9102 |
2.28mm (.090) Tab Terminal, 0.30mm (.012) Thickness, 0.3-0.5 AVSS, 0.25mm(.010) Thickness, Pre-Tin Plated
|
Molex Electronics Ltd.
|
| MAX16073 MAX16074 |
uP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package
|
Maxim Integrated Products
|
| 52207-1585 |
CONN,FFC,1MM OC,15POSRA(SM CONRA 15P 1MM)
|
Molex
|
| ASPI-0315FS-6R8M-T4 ASPI-0315FS-220M-T4 ASPI-0315F |
1 ELEMENT, 6.8 uH, NICKEL-ZINC FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 3030-15M, ROHS COMPLIANT
1 ELEMENT, 22 uH, NICKEL-ZINC FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 3030-15M, ROHS COMPLIANT
1 ELEMENT, 4.7 uH, NICKEL-ZINC FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 3030-15M, ROHS COMPLIANT
1 ELEMENT, 3.3 uH, NICKEL-ZINC FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 3030-15M, ROHS COMPLIANT
1 ELEMENT, 10 uH, NICKEL-ZINC FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 3030-15M, ROHS COMPLIANT
1 ELEMENT, 2.2 uH, NICKEL-ZINC FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 3030-15M, ROHS COMPLIANT
|
Abracon, Corp.
|
| 50011-8000 50011-8100 |
Crimp Socket Contact; Wire Size (AWG):30-24; Contact Current:2A; Contact Plating:Tin; Series:50011; Strip Length:2.1mm; Operating Temp. Min:-20 C; Pitch Spacing:2mm; Reel Quantity:10000; Voltage Rating:125V RoHS Compliant: Yes
Crimp Socket Contact; Wire Size (AWG):30-24; Contact Plating:Tin; Series:50011; Strip Length:2.1mm; Operating Temp. Min:-20 C; Pitch Spacing:2mm; Voltage Rating:125V RoHS Compliant: Yes
|
MOLEX INC
|
| DC0000091 |
Messerleiste 1mm SMD, 50 polig Male 1mm SMD, 50 contacts
|
ERNI Electronics
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
|
